![[Electronic Component Processing] Cutting, polishing, and grinding of ceramics, glass, etc.](https://image.www.ipros.com/public/product/image/281/2001145931/IPROS58516302818453406531.png?w=280&h=280)
[Electronic Component Processing] Cutting, polishing, and grinding of ceramics, glass, etc.
Leave the processing of ceramics and glass to us! We will introduce the cutting, polishing, and grinding processes we offer!
At DRS Corporation, we process electronic components such as ceramics and glass. We offer "multi-wire saw cutting" that enables high-precision cutting without damaging the workpiece, as well as "lapping and polishing" for double-sided and single-sided polishing of flat materials using loose and fixed abrasives. Additionally, we also perform "machining center processing" using high-speed rotating spindles. 【Service Overview (Excerpt)】 ■ Cutting Processing - Multi-wire saw cutting - Multi-blade saw cutting - Diamond outer blade cutting - Dicing cutting *For more details, please refer to the PDF document or feel free to contact us.
- Company：ディー・アール・エス（DRS)
- Price：Other
